Wave Soldering Machine

grabcad

The adjustable PCB plate width ranges from 50-300mm, with a board transport height of 700±5mm and speed of 0-2.0M/min. The PCB plate transport angle is between 3-7 degrees. The board can be transported in the L→R direction. The component height restriction for the PCB board is max.80mm. The preheating zone length is 1200mm, with three zones powered at 9kw each. The preheating zone temperatures range from room temperature to -220°C. Infra-red heating method is used and there's a single cooling zone. Lead-free solders are applicable. The tin furnace is made of 4mm x 316 stainless steel, with a maximum capacity of 300KG and a solder temperature range from room temperature to -300°C. Control modes include P.I.D for temperature control and touch screen +PLC for machine control. The flux storage tank can hold max.5L and has a flow rate of 10-100ml/min. It uses a US Parker rodless cylinder and Taiwan Mingli nozzle in spray mode. Power supply is 3 phase 5 wire 380V, with a starting power of max.13kw and normal operating power of approx.6.0kw (4-7KG/CM2). The machine's size is 3280/W1200/H1650mm.