Thermal analysis of a heatsink. Attachment report in doc format

grabcad

A heatsink, often spelled heat sink, is a passive device that transfers heat from electronic or mechanical components to a cooling medium like air or liquid, controlling device temperature optimally. In computers, it cools CPUs and GPUs, while also used with high-power semiconductors and optoelectronics. Design factors affecting performance include surface area, material choice, protrusion design, and surface treatment. Attachment methods and thermal interface materials impact integrated circuit temperatures, with thermally efficient heat sinks typically made from copper and/or aluminum. Copper is preferred for its high thermal conductivity, allowing quick heat dissipation, while aluminum is used for weight reduction in certain applications.