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SOP-8 Packaging

SOP-8 Packaging

grabcad

A SOP-8 package is utilized for housing semiconductor chips. This type of packaging offers a robust design that ensures the protection and stability of the integrated circuits within. The SOP, or Plastic Dual In-line Package, features a plastic body with two rows of pins, allowing it to be easily inserted into various circuit boards for efficient functionality.

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With this file you will be able to print SOP-8 Packaging with your 3D printer. Click on the button and save the file on your computer to work, edit or customize your design. You can also find more 3D designs for printers on SOP-8 Packaging.