SOP－8 Package
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A SOP-8 package refers to a type of electronic component packaging that measures 14mm x 13.5mm and houses surface mount devices, such as integrated circuits or transistors. The SOP acronym stands for "Plastic Dual In-line Package," indicating the plastic material used in its construction and the arrangement of pins in two parallel rows along the length of the package. This compact packaging design allows for efficient use of space on a printed circuit board, making it ideal for various electronic applications.
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