Raspberry Pi 3 Layered Laser-cut Case

thingiverse

Layered cases are available for both Raspberry Pi 3A+ and Pi 3B+. Multiple layers cut from 3mm MDF can be used, or any other 3mm material that can be cut. White boards with one side of the board facing up are recommended. The main file includes all case layers numbered from 1 (bottom) upwards, facing up. Tops files have different tops depending on what IO ports need to be exposed. Separate files are available for A+ and B+ designs. Cutouts are provided in the design for 15x15mm heatsinks on CPU and memory chips. Space is also available for a small 30x30mm 5v fan. The fan can be mounted to pull air out of the case, with a path for air flow over the wifi chip and through the CPU heatsink then out. Layer #8 has a gap for power wires to the fan, which can be hidden inside if a top with no GPIO access is used. The Raspberry Pi PCB sits between layers #1 and #3. Mounting uses M2.5x30 bolts or longer "legs" can be added if desired. Photos of building the case will be uploaded when available. Remember to take responsibility for your own actions, as you make the case and it's up to you to fix any issues that arise.