Raspberry PI 3 Box - Big Passive Cooling

thingiverse

This is an actively cooled Raspberry PI 3 box with a large 28mm x 28mm x 15mm heat sink, secured by a clamp on the long side. After researching various enclosure designs, I was unable to find one that utilized this unique approach and placement of the heat sink. To replicate this design in my "MagicMirror" project, I modified it to include a pressure-activated heat transfer system. The lid is attached to the top of the heat sink, which applies constant pressure down onto a small plate. This plate is then pushed against the CPU, ensuring optimal heat transfer. It's essential to apply thermal paste to both the CPU and the small plate for effective heat dissipation. To create this setup, you'll need a heat sink that fits the dimensions 28x28mm x 15mm, which can be sourced from https://www.aliexpress.com/item/Heatsink-28x28x15mm-Aluminum-heatsink-heat-sink-radiator-for-Electronic-Chipset-heat-dissipation/32712732874.html. Additionally, a copper or aluminum plate measuring 20mm x 20mm x 3mm is required to transfer heat from the CPU to the heat sink. You can opt for a single plate or use two stacked together, ensuring they adhere properly: https://www.aliexpress.com/item/10-pcs-20mmx20mm-0-3mm-to1-5mm-Heatsink-Copper-Shim-Thermal-Pads-for-Laptop-GPU/32806314067.html. In my design, I used a single 4mm thick copper plate as the heat transfer plate. However, the design files also include options for a 28x28 mm and a 38x38 mm version of the enclosure.