Press mold for notebook power connector Ø7.4 mm

thingiverse

I mold powerful connectors for notebooks and other devices using Ø7.4 mm molds. To achieve high-quality results, I rely on hot glue guns, which I use to create a strong bond between layers with a thickness of 0.1 mm. My nozzle diameter is precisely set at 0.5 mm. When attempting to produce even better quality connectors, I experiment with thinner layer thicknesses, such as 0.05 mm. This often yields more impressive results. Before pouring hot glue into the mold, I lubricate it with motor oil or Vaseline to ensure a smooth release. After filling the mold, I wait for exactly 30 minutes before carefully opening it. If you'd like to support my work, a thoughtful gesture would be to send me a dollar (or more). Unfortunately, due to circumstances in Ukraine, I'm unable to accept PayPal payments. However, if you're interested in making a contribution, I can provide you with the details of my card.