Open source slot die

thingiverse

L.Y. Beeker, Adam M. Pringle, Joshua M. Pearce. Open-Source Parametric 3D Printed Slot Die System for Thin Film Semiconductor Processing. Additive Manufacturing 20 (2018) 90–100. https://doi.org/10.1016/j.addma.2017.12.004 open access https://www.academia.edu/35667969/Open-sourceParametric3-DPrintedSlotDieSystemforThinFilmSemiconductor_Processing Franklin firmware: http://www.appropedia.org/Franklin OpenSCAD: http://www.openscad.org/ Open-Source Syringe Pump: http://www.appropedia.org/Open-sourcesyringepump Prusa Conversion - Follow Same Procedure as Open-Source Wax RepRap 3D Printer for Rapid Prototyping Paper-Based Microfluidics: http://www.appropedia.org/Open-sourceWaxRepRap3-DPrinterforRapidPrototypingPaper-Based_Microfluidics With New X Carriage Provided in This Paper. https://osf.io/m2zqk/ Slot Die Coating Gains Popularity Due to Low Operational Costs and Easy Scaling. The Complex Inner Geometry of Conventional Slot Dies Requires Expensive Machining, Limiting Accessibility and Experimentation. To Overcome These Issues, This Study Takes an Open Hardware Approach, Using an Open-Source 3D Printer to Both Fabricate the Slot Die and Functionalize a 3D Slot Die Printing System. Polymer Materials Are Tested and Selected for Compatibility with Common Solvents and Used to Fabricate a Custom Slot Die Head. This Slot Die Is Then Integrated into a 3D Printer Augmented with a Syringe Pump to Form an Additive Manufacturing Platform for Thin Film Semiconductor Devices. The Full Design of the Slot Die System Is Disclosed Here Using an Open-Source License, Including Software and Operational Protocols. This Study Demonstrates That Functional Lab-Grade Slot Dies May Be 3D Printed Using Low-Cost Open-Source Hardware Methods. A Case Study Using NiO2 Found an RMS Value of 0.486 nm, Thickness of 17–49 nm, and a Maximum Optical Transmission of 99.1%, Showing This Additive Manufacturing Approach to Slot Die Depositions as Well as Fabrication Is Capable of Producing Viable Layers of Advanced Electronic Materials. Using This Method, a Cost Savings of Over 17,000% Was Obtained When Compared to Commercial Slot Die Systems for Laboratories. Materials and Methods See http://www.appropedia.org/Open-source_parametric_3-D_printed_slot_die_system_for_thin_film_semiconductor_processing