Matchplate parts for Aluminum sand cast for Raspberry Pi Zero v 1.3 case

thingiverse

Design for a case for the Raspberry Pi Zero version 1.3 to be sand cast in Aluminum. This design has a "riser" to put the top of the CPU/Memory Package on package in contact with the top of the case, improving heat dissipation efficiency. Heat dissipation fins averaging 1 mm in width run along the short axis on the top, ensuring optimal thermal management. Since this is intended to be sand cast, there's a five degree draft to the vertical surfaces for ease of removal and reduced stress concentrations. The two halves of the matchplate have been scaled up to 101% to account for standard aluminum shrinkage in sand casting. Four ninety-degree cones on the pcb standoffs on the heat fin side, and four ninety-degree cones on the underside of the bottom piece enhance structural integrity and stability. A clearance hole should be drilled into the bottom piece for an M2.5 screw, allowing for flush mounting. The top piece should have these cones drilled for threading to accommodate an M2.5 screw with 75% thread engagement size, typical for aluminum. The riser has been extended down to the surface of the board to ensure proper machining and contact with the CPU/Memory Package. This design ensures that the resulting cast is machined flat to the correct height, guaranteeing optimal performance. To facilitate verification of fitment, I'm including the full Sketchup model as well as STL files of the two case halves for 3D printing. Although I haven't had a chance to test this out yet, feedback from anyone with sand casting experience would be highly appreciated. Licensing for commercial use can be negotiated, and any interested parties should feel free to reach out for further discussion. Update: After consulting with experienced individuals in sand casting and aluminum, I've made some adjustments to the matchplate design to improve its functionality.