Large DIP IC Lead Bender v1.00
thingiverse
This is a versatile pin bender designed for the larger types of Dual In-Line Package Integrated Circuit (DIP IC) chips. It is an upgraded version of my Small DIP IC Lead Bender, available on Thingiverse under ID number 3121797. When used in combination with its smaller counterpart, this tool should be able to handle most types of DIP ICs. Time required: Approximately one hour and fifty-two minutes. Material usage: The pin bender was created using 6.93 meters of PLA filament, weighing approximately 21 grams.
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