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IC Packages TSSOP

IC Packages TSSOP

grabcad

A thin-shrink small outline package (TSSOP) surface-mount device (SMD) IC package is available in versions ranging from 8 to 56 pins.

Download Model from grabcad

With this file you will be able to print IC Packages TSSOP with your 3D printer. Click on the button and save the file on your computer to work, edit or customize your design. You can also find more 3D designs for printers on IC Packages TSSOP.