IC Package MicroSIP
grabcad
The integrated circuit (IC) is embedded within a FR-4 laminate substrate (Printed Circuit Board), featuring a power inductor mounted on the material's surface. It resembles a standard 8-pin DFN package, known as a MicroSiP model. With dimensions of 3.5mm x 3.5mm x 1.75mm, this module houses a simple switcher circuit, specifically an step-down DC-DC converter.
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