HICTOP build plate leveler

thingiverse

I'm familiar with the common issue of a bowed-down build plate on my HICTOP 3DP-11-AL (3DP-12). My auto-leveling using the inductive sensor wasn't working perfectly due to this problem, resulting in poor performance. Updating the firmware to include bilinear leveling helped some, but I still noticed the bowing effect. To address this issue, I designed a piece that fits under the build plate and gently pushes it up, minimizing the bowing effect. The smaller pieces are twisted into the cutouts in the build plate and contain an M3 nut, while an M3 bolt passes through both of them to support the bar that sits across them. The level of this support bar can be adjusted by turning the bolts. If your build plate is more bowed at the front than at the back, position the smaller pieces closer to the front of the cutouts. Analyzing the sensor height during auto-leveling has shown significant improvements. I've also tested rapid prints at various temperatures and saw minimal movement, although it's possible for the M3 bolt to loosen over time. To prevent this issue, consider updating to a nylock nut or adding springs. Since my build plate is made of ABS, which can withstand exposure to the plate, I print with PLA at temperatures below 70C.