Heat transfer analysis on PCB Circuits.
grabcad
Modern printed circuit boards (PCBs) face design reliability issues due to their complexity, affecting electrical, thermal, and mechanical aspects. Rising power dissipation and shrinking board size increase the possibility of electronic system failure from overheating and stress. Simulating coupled electrical, thermal, and thermally induced stresses is vital for guaranteeing PCB reliability. An upcoming webinar will showcase advanced simulation methods to assess signal and power integrity, forecast thermal performance, and tackle thermal strain, paving the way for cost-effective and timely reliable PCB designs.
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