Hardkernel ODROID-XU4Q passively cooled case

thingiverse

The design takes its base from the "Odroid XU4 case" by apedroid, but a significant modification is made to the top section. A 41mm x 41mm hole is incorporated specifically for the ODROID-XU4Q's passive heatsink. The heatsink itself measures nominally at 40mm x 40mm, so this addition provides a modest gap. The creation process involved importing apedroid's STL file into Blender and then performing a boolean difference with a 41mm cube. To ensure a smooth finish, the mesh was fixed using the [Blender 3D Printing Toolbox]. To assemble the case, each part should be printed with the flat side facing downwards. For my project, I utilized a Monoprice Select Mini printer, paired with gray eSun PLA PRO 1.75mm filament.