Grove Temperature Sensor Case for Seed Studio - WIO Link

thingiverse

This 3D design serves as a casing for Grove temperature and humidity sensor which integrates seamlessly with Seed Studio's WIO Link product. The casing consists of two distinct parts: a base where the sensor is secured using three small fasteners, and a lid that clicks into place. The lid features two rectangular openings to accommodate the sensor device on the PCB assembly and the cable connector. If I were to revise this design, I would adjust the rectangular hole in the lid for a better fit with the sensor. This model was successfully printed on a Makerbot Replicator+ using PLA filament. As recommended for the Replicator+, a raft was used during printing. Other printers might not require a raft. A 5% infill setting was chosen and proved to be sufficient. This casing is a modified version of the "Grove Sensor Mount - Large" model, originally published by Ccirone2 on March 9, 2017.