Fairphone 4 - slim bumper

Fairphone 4 - slim bumper

thingiverse

A slim bumper for the Fairphone 4. Easy to print, no support needed with any rigid or semi-rigid filament (ABS, ASA, PLA etc). Best to setup the slicer with 3 perimeters. The case has better thermal management than any other case and it will help in longer life for the battery and the SOC. It also provide a clear view of the back logo with minimal visual impact. The print is ~1:30h long and uses ~15g of filament. (Later edit) V2 has better cuts for the left microphone and top/bottom/right lips for better structural strength.

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