DFN16, 4x1.6, 0.5P.step
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The ON Semiconductor DFN16 is a 16-pin VFDFN (Very Flat Low Profile Dual Face Down) IC package with exposed pads for thermal management, measuring 4mm in width by 1.6mm in height and featuring a thickness of only 0.5mm to ensure optimal device mounting in applications that demand the smallest possible footprint without compromising on electrical performance or thermal characteristics of this particular type of integrated circuit, such as power conversion ICs exemplified by NUF8402MN which represents a product that would use such a packaging format for improved efficiency and lower system heat generation in space-sensitive electronic systems.
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