chip DIL8 Low-poly 3D model

cgtrader

The low poly integrated circuit model is in a DIL8 package and constructed using Maya 7 software, ensuring clean topology without N-gons. The model features UV mapping with non-overlapping unwrapping, rendered with V-Ray version 1.5 in 3ds Max. A render scene is included, and the materials are basic blinn types with layered textures nodes in the Maya file. Multiple formats are available, including Maya 7 (.ma, .mb), OBJ (.obj with .mtl), 3ds Max 2009 (.max), and Autodesk FBX (.fbx). The FBX and OBJ formats were directly exported from Maya. The model consists of 489 quads and 932 triangles, with 482 vertices. Textures for the chip_DIL8 model are included in a zip file, featuring 1024x1024 pixels .jpg opacity (transparent) maps for two label versions, 1024x1024 pixels .jpg diffuse (color) maps (not used), and a 1024x1024 pixels .psd working map for potential label changes or additional textures.