chip DIL16 Low-poly 3D model

cgtrader

This low poly integrated circuit model is in a DIL16 package, created using Maya 7 with clean topology and no N-gons. UV mapping has been done without overlapping, and rendering was performed with V-Ray version 1.5 in 3ds Max. The render scene is included, along with basic blinn materials utilizing Layered Textures nodes in the Maya file. Available formats are Maya 7 (.ma, .mb), OBJ (.obj with .mtl), 3ds Max 2009 (.max), and Autodesk FBX (.fbx). Both FBX and OBJ were directly exported from Maya. The model consists of 857 quads/1692 triangles and 878 vertices. Textures included in the chip_DIL16_textures.zip file are a transparent opacity map, two diffuse color maps (not used), and a PSD working map for potential label changes or additional texture creation.