Case DIP-8C
grabcad
Notes:1. Package dimensions conform to JEDEC specificationMS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)package with .300 inch row spacing.2. Controlling dimensions are inches. Millimeter sizes areshown in parentheses.3. Dimensions shown do not include mold flash or otherprotrusions. Mold flash or protrusions shall not exceed.006 (.15) on any side.4. Pin locations start with Pin 1, and continue counter-clockwiseto Pin 8 when viewed from the top. The notch and/ordimple are aids in locating Pin 1. Pin 3 is omitted.5. Minimum metal to metal spacing at the package body forthe omitted lead location is .137 inch (3.48 mm).6. Lead width measured at package body.7. Lead spacing measured with the leads constrained to beperpendicular to plane T.
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