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Bump Vase - Solid Remix (Lower Poly)

Bump Vase - Solid Remix (Lower Poly)

thingiverse

Accommodating the printing requirements for vase mode, I made it a more robust and solid design. Additionally, I reduced the poly count to optimize print performance. With a 0.6mm nozzle diameter and layer thickness of 0.35mm, I printed using transparent PLA at 210 degrees Celsius and a speed of 80mm/s. The printing process took approximately two hours and seven minutes in vase mode.

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