BGA package

BGA package

grabcad

Wire-bonded BGA components are used in various electronic devices, offering enhanced reliability and improved performance. These components feature ball grid arrays that are connected to the die via fine metal wires, ensuring secure and reliable connections. By utilizing this technology, manufacturers can create high-quality electronic products with increased durability and performance capabilities.

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With this file you will be able to print BGA package with your 3D printer. Click on the button and save the file on your computer to work, edit or customize your design. You can also find more 3D designs for printers on BGA package .