4" Wafer Centering Tool
thingiverse
Introducing a wafer centering tool designed for a 100mm-diameter wafer, suited to use with spinner stations. This model fits an open manual placement ring and a 45mm chuck. Printed in black PLA from JustPLA, settings include a 190C temperature, 70C bed, 0.2mm layer thickness, and a 0.55mm nozzle diameter. A recommended 2mm brim for the end handle should be printed, followed by trimming with a razor, screwing handle1 into the ring, and securing handle2 via press-fit or glue. This tool guarantees perfect wafer centering every time.
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